Jyoti Rani, K. J. Singh, and Ramvir Singh. “Prediction of Effective Thermal Conductivity of Cu Solder System by Using Interfacial Layer in Two Phase System”. Asian Journal of Engineering and Applied Technology 3, no. 2 (August 2, 2014): 16–18. Accessed August 26, 2025. https://www.ajeat.com/index.php/ajeat/article/view/712.